Established Microdiode Electronics

Meanwhile, we applied for the core brand trademark SEP in International Class 9, which was successfully registered in 2008 with exclusive rights valid until 2028, marking the establishment of the complete brand system.

Its main businesses cover packaging, production and trading of basic discrete components such as diodes, transistors and rectifier bridges.It has built its own packaging factory in Shenzhen with over 100 employees and a monthly production capacity of 50 million pieces. It adopts fully imported equipment to produce through-hole and SMD components.

Sales departments have been set up in East and South China respectively. The product line has been expanded from basic diodes to rectifier bridge stacks, MOSFETs, Schottky diodes, fast recovery diodes, IGBTs, chips and other products, forming a comprehensive power semiconductor product portfolio. Meanwhile, multiple affiliated trademarks including ···

The company obtained its first utility model patent An Automatic Correction Structure for Rectifier Bridges (authorized in April 2022, inventor: Zhang Guowei), marking its official transition from basic manufacturing to technical solution provision.

Applied for the utility model patent An Easy-to-Install Rectifier Bridge (Inventor: Zhang Guowei), further focusing on the industrial practicality and production convenience of packaging structures.

It was awarded the title of Excellent Domestic Brand Enterprise by Huaqiang Electronic Network. In November of the same year, it was certified as a National High-tech Enterprise, and in December recognized as a Shenzhen Specialized, Refined, Differential and Innovative SME. This marks official recognition of the company's R&D strength, tech···

It continues to consolidate its position in the semiconductor packaging market of Shenzhen and South China, covering a factory area of 6,000 square meters with 85 staff members. Third-generation semiconductor devices such as silicon carbide MOSFETs have been incorporated into the supply system, with packaging forms covering mainstream specification···